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VIA Corporate Overview

VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards.

Headquartered in Taipei, Taiwan, VIA's global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world's top OEMs and system integrators. VIA is registered on the Taiwan Stock Exchange (TSE 2388).

» Complete Platform Provider
» Market Leadership
» Global Operations
» Meeting the Market Challenge
» Enabling New Markets
» Demanding Quality Throughout
» Dynamic Fabless Business Model


Complete Platform Provider

VIA offers the richest blend of silicon solutions from a single vendor, supporting the full spectrum of x86 technologies from the highest bandwidth I/O to the greatest resolution displays, and from the highest bit-rate audio to the most power efficient, smallest and lowest profile processors. VIA also designs complete, highly integrated and ultra compact platforms featuring VIA silicon building blocks, the VIA EPIA series of Mini-ITX, Nano-ITX and Pico-ITXmainboards. A full introduction to the VIA product portfolio may be found here.


Market Leadership

Boasting a long line of product and technology firsts, VIA has kept ahead of the industry through anticipating appropriate upcoming technologies and implementing them either as discrete silicon or integrated into the widest range of core logic chipsets in the industry. Implementing support for PC133 SDRAM and subsequently DDR SDRAM memory across all major processor platforms marked the successful introduction of these standards to the industry and clearly designated VIA as a market driver for new technologies.

There are too many firsts to mention here, covering nearly every business unit within VIA; however, on the audio side alone, VIA brought the first 6-channel audio codec (VIA Vinyl Six-TRAC) to market in April 2001, and also created the first high-definition 8-channel audio controller supporting the latest 24-bit/192kHz PC audio in the VIA Envy24HT, released in 2002, with the onboard version (VIA Envy24PT) launched in early 2003.

VIA has also lead the market in miniaturization of the platform, in order to allow the system design innovation that will drive the next generation of Personal Electronics form factors. Successive VIA Eden processors have been the smallest, lowest power and lowest profile native x86 processors on the market, and feature the world's most advanced hardware security features, while the VIA EPIA Pico-ITX mainboard launched in 2007 is the smallest standard x86 platform at just 10cm x 7.2cm. Moreover, VIA strives to integrate more technologies into the core logic as part of the Distributed Platform Performance Initiative, which spreads the workload across the platform and also saves on board real estate, and has achieved numerous firsts in this field, such as the first integrated multi-configuration of Serial ATA/RAID into the South Bridge (VIA VT8237R, launched in July 2003) and hardware video decoding acceleration into the North Bridge in numerous chipsets, Starting with the VIA CLE266, launched in 2002.


Global Operations

VIA has created a global network linking the IT hubs of Silicon Valley and Texas in North America with the Greater China Manufacturing Engine, including China and Taiwan, as well as facilities in Bonn in Germany. This network allows the company to leverage the infrastructure of the world's leading high tech R&D and manufacturing centers, and also enables rapid and local response to the changing needs of its customers, supporting them on a global basis.

Approximately 70% of the 2,000+ workforce are highly skilled and experienced engineers, complemented by a strong multinational management team with an extensive technical background.


Meeting the Market Challenge

VIA meets the ever-changing demands of the computing and communications markets by anticipating and developing the most appropriate new technologies to satisfy customer needs in terms of functionality, performance and cost effectiveness. The company unites industry partners to facilitate – rather than impose – the implementation of these new technologies onto the market, thereby widening the choices available to both its customers and the individuals and businesses that buy from them. Close and constant interaction with customers enables VIA to fully understand their requirements and provide a complete spectrum of technology design services. A full range of post-sales customer support services is delivered through dedicated sales and FAE teams located in offices worldwide.


Enabling New Markets

Innovation in system design and application arises from many areas, and especially in the field of Personal Electronics, where the x86 architecture is being extended to form the basis of the digital lifestyle. In striving to enable companies to quickly and cost efficiently develop products for these exciting new and fast-emerging markets, VIA created the Spearhead Platform Initiative to provide complete platform or system reference designs on which these new products can be based. Leveraging VIA's extensive engineering expertise in hardware design and compatibility, and software, these reference designs are leading the way in driving new and fast-emerging markets.


Demanding Quality Throughout

VIA's Manufacturing Engineering and QC Teams work closely with manufacturing and assembly partners to ensure world class levels of product quality and reliability. All silicon chips shipped by VIA undergo the most exacting testing procedures possible, and our commitment to quality is demonstrated by ISO 9001/2000 certification for production and quality assurance, as well as meeting the rigorous supplier requirements of leading PC OEM and motherboard customers.


Dynamic Fabless Business Model

As IC manufacturing processes become ever more complex and capital-intensive, VIA's close partnerships with the world's leading silicon foundries and packaging and testing houses are assuming increasingly vital importance. This fabless business model provides access to the most up-to-date production and technologies and ensuring production, so providing the flexibility to ramp up volumes to meet sudden changes in market demand, while enabling VIA to focus on core product design competences.


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