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Join VIA@Computex 2009

VIA CPU Platforms

Taipei International Convention Center
2nd Floor, Room 201D

VIA Embedded

Taipei World Trade Center
Nangang Exhibition Hall, Booth L409A

VIA Nano Processor: Driving Mobile Momentum

Join VIA@Computex 2009 and discover the future of power-efficient, HD capable processor platforms. The VIA Nano processor platform is gaining market momentum with a growing number of top tier partners in a range of device segments including mini-note and full featured thin and light notebooks.

Mobility meets HD entertainment and superior application performance in compact, power-efficient designs that expand beyond traditional form factor boundaries.

Join VIA at the TICC, 2nd floor, room 201D and see first hand how VIA's latest system platforms are driving a new era in power-efficient, HD computing.

Embedded in Your Success

VIA Embedded will showcase the very latest in small form factor device design with a range of system level products including robust and fanless industrial PCs, digital signage and panel PC solutions, and innovative server products. Board level solutions include the first boards to market based on the recently launched, VIA developed Pico-ITXe and Em-ITX form factors, as well as the new VIA In-Vehicle platform.

Taste the future of digitally embedded brilliance and learn about our new system level customization services at Computex 2009, and visit VIA Embedded at the Nangang Exhibition Hall, Booth L409A.

To arrange a meeting with a VIA representative please click here.

Computex 2009 Press Conference

The VIA press conference took place at the Grand Hyatt Taipei Hotel on Wednesday 4th June. Richard Brown, Vice President of Marketing, gave a brief overview of the mobile market, and how VIA and its affiliate VIA Telecom are bridging the gap between mobile computing and communications.

Timothy Chen, Special Assistant to the President, reviewed short- and long-term trends, and noted how VIA's strategy has remained focused on power efficient design, rich feature integration and innovative platform design, driving the market towards smaller, lighter, more mobile systems – and even those that blur the standard device category boundaries, as x86, ARM and communications converge in ever more ubiquitous ways. He also noted how the burgeoning demand in China for all things tech is an ideal platform for the VIA GMB Alliance to help proliferate mini-notes in this exciting market.

Ker Zhang, the CEO of VIA Telecom, expanded on the China theme, giving an overview of the 3G market there, and how its CDMA silicon is helping to drive this market. An array of some of the latest devices was on show, including leading-brand notebooks and mini-notes, and boundary-blurring products such as the Fugoo digital internet device for the home.

Find out more by downloading the press conference VIA presentation decks:
- VIA Press Conference Introduction
- VIA Riding the Long Wave

Images of the press conference can be downloaded here:
- High resolution
- Low resolution

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