VIA Unveils Its Latest Embedded Platforms at ESC Silicon Valley 2010
Embedded System Conference
May 2 – 5, 2011
McEnery Convention Center, San Jose
Booth No. 2032
Join VIA at Embedded Systems Conference 2011 where you can experience the very latest embedded systems, boards and components that span VIA’s unique ARM, x86, multi-core x86 and graphics processor portfolio.
Visitors to ESC 2011 will enjoy examples of the latest embedded systems and boards featuring the new fanless multi-core processor demoed alongside the latest VIA VX900 chipset; the industries most scalable, fanless and full-featured processor platform, ideal for a broad range of embedded device designs.
The latest VIA graphics cards, the industry's first discrete graphics solutions designed specifically for embedded markets, will be shown delivering multiple HD 1080p content streams, demonstrating how VIA’s uniquely low power graphics solutions transform any PCIe capable system into a multimedia power house while also offering crucial product and component-level longevity support.
As well as VIA's latest Mini-ITX and Pico-ITX board products, VIA will also show unique COMe and Q7 module solutions, as well as the latest ARM system-on-chip platforms, underscoring VIA's unique position in the market as the only company worldwide with a scalable range of both ARM and x86 product offerings.
Come join us at Embedded Systems Conference 2011 and see how VIA Technologies is empowering the next generation of embedded products.