VIA at Embedded Systems Expo in Tokyo

Tokyo, Japan May 16-18, 2007

Tokyo big Sight, Booth No. 32-15

Main VIA Booth: 32-15    (see floorplan)

Come join us and see the exciting pace of miniaturization and integration making the x86 platform more accessible to the embedded market. You will get the opportunity to see the remarkable small form factor and rich integration VIA has achieved to make it the clear leader in enabling a whole range of new computing possibilities.

With the richest blend of ultra-low power processors, feature-rich chipsets and a full complement of companion chips, VIA can provide complete x86 platform requirements at just one stop, giving you the best single-point-of-service, guaranteed platform compatibility and greatly reducing your product development time. The VIA EPIA mainboards feature all the latest technologies within the signature ultra compact form factors will be shown at this event, including the very latest VIA EPIA Mini-ITX, Nano-ITX and the Pico-ITX mainboards. The Pico-ITX form factor is the smallest full-featured single board computer, measuring only 100mm x 72mm, with over 75% size reduction from the popular Mini-ITX mainboards, it is the most compact embedded board from VIA for almost every application.

Join us at Booth 32-15 to see how VIA is underpinning the next generation of embedded development.