VIA Core Management Team

VIA's top management comprises top executives who have pioneered the chipset industry and the transition of VIA to a complete processor platform provider with a combination of extensive technical backgrounds and international experience.

Cher Wang, Chairman

Cher Wang has extensive experience in the IT industry, and was instrumental in driving the development of First International Computer, Inc. (FIC) into the motherboard business while in the position of General Manager of the PC Division. She is currently acting Chairman of the High Tech Computer Corporation (HTC) as well as VIA. Ms Wang attained her Masters in Economics from the University of California, Berkeley, and is a devout Christian. She is married with two children.

WenChi Chen, President & CEO

Wenchi Chen has been President and CEO of VIA Technologies, Inc. since 1992, and has overseen its transition from chipset designer to a leading developer of silicon chip technologies and PC platform solutions. Mr. Chen's strong background in logic design, marketing, and business strategy has propelled VIA to be one of the foremost fabless semiconductor design houses in the world. Prior to VIA, Mr Chen co-founded and was President and CEO of Symphony Laboratories. He also held positions of Sales & Marketing VP at high tech start-up ULSI and senior architect at Intel. A committed Christian, Mr Chen holds a MSEE degree from National Taiwan University and MSCS from the California Institute of Technology.

Under Mr Chen's leadership, VIA has become the world's leading developer of PC core logic chipsets, successfully enabling the industry wide adoption of PC133 and DDR266 SDRAM as the next generation memory standards. Building on the company's strength in core logic chipsets, Mr Chen has expanded the company's technology leadership into low power x86 microprocessors with the acquisition of Cyrix and Centaur, high performance graphics with the S3 Graphics joint venture, networking, communications, and multimedia chips, as well as innovative form factor mainboard solutions. With a comprehensive portfolio of key building block technologies now in place, VIA now provides customers with complete platforms for building a full range of PCs, servers, notebooks, and Personal Electronics devices.

TzuMu Lin, Senior Vice President, R&D Engineering

Specializing in integrated circuit and system design for computer and communication systems, Tzu-Mu Lin gained an MSEE and a doctorate in Computer Science from the California Institute of Technology and has followed a distinguished career in the industry. As Senior Vice President at VIA Technologies, Inc., Mr Lin has guided the development of PC core logic chipsets and overseen VIA's remarkable transition from PC-centric technologies to system and communication platform solutions covering a series of quality and cost-effective system logic, graphics and multimedia, optical storage, networking, wireless and mobile communication technologies and products.

Prior to joining VIA, Mr Lin was co-founder and Vice President of Design Technology, Symphony Laboratories. He has also held the position of Director of Engineering at GS Technology in charge of all IC design, including ASIC, full custom implementation as well as analog and digital technology, as well as Design Manager for Silicon Compiler Systems, a key contributor to the engineering success of the company's VLSI CAD tools.