VIA Lead-Free Products
In traditional manufacturing processes, lead is used
in the bump that attaches the silicon core to the inside
of the package and to facilitate integration onto the
motherboard through tiny solder balls on the underside
of the package. VIA's lead-free manufacturing technologies
do not require a lead bump and the solder balls now
consist of a Tin, Silver and Copper composite.
Silicon products that are available from VIA in a lead-free
option include all x86 Socket 370 VIA processors, all
x86 VIA processors in the EBGA package, all VIA chipsets
and all VIA companion chips. These lead-free packages
include the letter "G" on their top marking to signify
their suitability for Green Computing systems.
All VIA processors and chipsets are available in a
lead free package option and marked with a 'G' for Green Computing.
All VIA companion chipsets are available in a lead
free package option and marked with a 'G' for Green Computing, including audio, networking, multimedia and
optical storage chips.
VIA continues to work towards compliance across all
product groups with the RoHS and WEEE European Union
directives that are helping to speed up the move to
environmentally friendly computing.