The VIA OpenBook comes with all the expertise VIA Technologies has proven through technological innovation. Our advancements and leadership in low power consumption, platform miniaturization and feature integration have all been brilliantly incorporated in to the VIA OpenBook Mini-Note Reference Design platform.
VIA C7®-M ULV Processor
The VIA C7®-M ULV processor* family ranges in speed from 1.0 – 1.6 GHz using a 90nm manufacturing process. To ensure enhanced low power consumption the maximum thermal design power (TDP) ranges between 3.5 watts to 8 watts, depending on the speed chosen, and idle power is as low as 0.1 watt, thus ensuring extended battery life. This is complemented by a low profile nanoBGA2 package measuring just 21mm x 21mm enabling designs with drastically reduced weight, size, and thickness.
* For full details of the VIA C7®-M ULV Processor, click here.
VIA VX800 Digital Media IGP Chipset
The VIA VX800* unified Digital Media IGP chipset has been designed specifically for today's ultra thin and compact mini-note devices. It integrates all the advanced features of a North and South Bridge dual chip and saves over 42% of silicon real estate over standard twin-chip core logic implementations.
* For full details of the VIA VX800 Digital Media IGP Chipset, click here.
Global Connectivity and Additional Features
The VIA OpenBook supports Microsoft® Windows® XP, Windows Vista® and Linux operating systems and to maximize internet access there is an internal modular interface that has BlueTooth, WiFi, AGPS and Ethernet capabilities as well as a choice of standardized wireless extended connectivity modules supporting WiMAX, HSDPA or EVO-DO/W-CDMA 3G services.
The VIA OpenBook Mini-Note Reference Design is the next generation of the mini-note design platform and incorporates all the best features of earlier models with key enhancements. The higher resolution and larger size of the screen brings a richer viewing experience and the slim, custom designed, clamshell form factor brings new functionality and style.