4th Annual VIA Technology Forum Attracts Broad Industry Support

Major hardware and software partners gather in Taipei, Beijing and Tokyo in September to define sustainable growth models and key directions for the IT industry

Taipei, Taiwan, 8 September 2003 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today confirmed the backing and participation of over 30 partners from across the IT industry at VTF2003, being held in Taipei, Beijing and Tokyo at the end of September, bringing a wealth of industry knowledge and expertise to the event and clearly demonstrating how all the players need to work together to enable the next stage of Total Connectivity: The Revolution.

"VIA Technology Forum is widely recognized as the strategic regional technology platform that brings together the key industry players that is reflected by the long-term support of the event by most of our VTF2003 partners," said Richard Brown, Associate Vice President of Marketing, VIA Technologies, Inc. "With the participation of such a broad array of organizations in the IT industry, VTF goes from strength to strength, again serving up a relevant and compelling spectrum of topics over the three events."

It is especially noteworthy that all of this year's Platinum Sponsors have supported the event for several years at a senior level: AMD and Maxtor join key DRAM memory vendors Elpida, Hynix, Infineon and Micron reviewing the various aspects of hardware implementation in today's computing and connecting environment, while Microsoft, InterVideo and Phoenix will provide insights into the software market.

As in previous years, VTF2003 has once again garnered the strong support of Taiwan's motherboard manufacturing community, with Soltek heading up a list that includes ABIT, Acorp, Albatron, Aopen, Biostar, Epox, FIC, Gigabyte, Jetway, MSI, Shuttle and Soyo, while the investment community is represented by Credit Suisse First Boston, J.P. Morgan Chase and UBS Warburg.

Embedded hardware developers AAEON and Advantech provide industrial PC and embedded design expertise, and Kentron Technologies will provide update attendees on QBM memory. On the manufacturing side, Cadence will examine interface design issues and Cypress will look at the manufacturing challenges posed by upcoming performance technologies, while ASE will offer strategic market insights; they will be joined by Siliconware Precision Industries and Tektronix, leading monitor house Worldtech, and key distributors FAE Electronics, Silicon Application Corp and Takebishi Electric Sales.

Full details of VTF2003 sponsors and exhibitors may be found at:
http://www.via.com.tw/en/vtf2003/vtf2003sponsor.jsp#sponsors

For more information on the VIA Technology Forum 2003, please visit the website at:
http://www.via.com.tw/vtf

About VIA Technology Forum

The VIA Technology Forum (VTF) showcases VIA's commitment to develop an innovative open architecture technology platform that enables our partners to design, manufacture and market products that exploit the possibilities and enhance the scope and utility of Internet connectivity. The theme, 'Total Connectivity: The Revolution' reflects how the PC platform is completing the revolution from a computing machine to a connecting device that fits smoothly into our living environment, and embraces the key elements of VIA's Total Connectivity vision, including convergence, pervasive connectivity, increased functionality in mobile devices and the trend towards smaller and quieter systems, and looks at how they have created a momentum in the industry for system design innovation, making the living room PC and the always-connected consumer a reality.

The technology tracks this year are Performance Computing, looking at key technologies that will drive further advances in performance in home and enterprise systems, including performance processing, memory technologies, and peripheral and chip interconnects; and Connected Lifestyle, covering elements of the Total Connected lifestyle, from technology trends in notebooks, mobile devices and phones, to digital media platforms and embedded applications, with a focus on real end market applications.

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