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News Release

VTF2003: Dr Morris Chang of TSMC Heads Strong Keynote Speaker Line-up at VIA Technology Forum in Taipei

VTF Taipei 2003 boasts a broad array of keynote presenters including senior representatives from TSMC, AMD, Maxtor, Micron and Phoenix

Taipei, Taiwan, 15 September 2002 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today confirmed that Dr Morris Chang, founding Chairman of Taiwan Semiconductor Manufacturing Company will address the upcoming VIA Technology Forum 2003 in Taipei.

Pioneer of the dedicated silicon integrated circuit foundry, Morris Chang is widely acclaimed as one of the key architects of Taiwan's dominance in the high-tech world, and has had numerous honorary degrees and awards bestowed upon him in recognition of his outstanding contribution to the microelectronics industry.

"As we see VIA's Total Connectivity vision become a reality, VTF maintains and strengthens its position as an important and relevant platform for the industry's leading players to set the agenda for the future," said Morris Chang. "I am therefore delighted to be given the opportunity to address such an audience at VTF2003, and look forward to another beneficial event for all participants."

Following the title address by VIA President and CEO Wenchi Chen on the VTF Theme, 'Total Connectivity: The Revolution', Dr Chang will open the VTF2003 keynote session in the Grand Ballroom of the Grand Hyatt Taipei Hotel on Wednesday 24th September 2003, followed by addresses from Platinum Sponsors AMD, Maxtor, Micron and Phoenix.

"The presence of Morris Chang guarantees timely and far-reaching insights on the IC industry, which is always a welcome addition to the VTF agenda," said Wenchi Chen, President and CEO of VIA Technologies, Inc. "We are privileged that he has again agreed to join us at VTF 2003, and feel sure that the knowledgeable audience that VTF attracts will benefit from his strategic vision for the industry."

VTF2003 comprises three one-day events in Taipei, Beijing and Tokyo on the 24th, 26th and 30th of September respectively, and has attracted major sponsors including AMD, Elpida, Hynix, Infineon, InterVideo, Maxtor, Micron, Microsoft and Phoenix. For more information on the VIA Technology Forum 2003, please visit the website at: www.via.com.tw/vtf.

About the VIA Technology Forum

The VIA Technology Forum (VTF) showcases VIA's commitment to develop an innovative open architecture technology platform that enables our partners to design, manufacture and market products that exploit the possibilities and enhance the scope and utility of Internet connectivity. The theme, 'Total Connectivity: The Revolution' reflects how the PC platform is completing the revolution from a computing machine to a connecting device that fits smoothly into our living environment, and embraces the key elements of VIA's Total Connectivity vision, including convergence, pervasive connectivity, increased functionality in mobile devices and the trend towards smaller and quieter systems, and looks at how they have created a momentum in the industry for system design innovation, making the living room PC and the always-connected consumer a reality.

The technology tracks are Performance Computing, looking at key technologies that will drive further advances in performance in home and enterprise systems, including performance processing, memory technologies, and peripheral and chip interconnects; and Connected Lifestyle, covering elements of the Total Connected lifestyle, from technology trends in notebooks, mobile devices and phones, to digital media platforms and embedded applications, with a focus on real end market applications.


VIA PR Contacts

International: Europe:
Richard Brown
Phone: (886)-2-2218-5452 #6201
Fax: (886-2)-2218-5453
Email: Richard_Brown@via.com.tw
Michal Lisiecki
Phone: (49-2241) 39778-16
Fax: (49-2241) 39778-19
Email: MichalLisiecki@via.com.tw

Note to reporters, editors and writers: VIA is spelled in ALL CAPS.

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