News Release
VIA Telecom Attracts Senior Industry Talent
Leading figures in US and China telecommunications
to strengthen VIA Telecom management team and drive
3G market adoption
San Diego, California, 22 September 2003 - VIA Telecom,
Inc., a leading innovator and developer of Code Division
Multiple Access (CDMA) chipsets today announced the
appointment of two well-known and highly respected industry
executives, Robert Gilmore and Yupu Xie, bringing a
wealth of industry expertise to VIA Telecom.
Robert Gilmore joined VIA Telecom as the Vice President
of Engineering in August 2003, and has held senior management
positions at various high profile companies in the US.
He was a co-founder of Mobilian, a company specializing
in Bluetooth and Wireless LAN system ICs, where he was
Vice President of Engineering. Robert was an early member
of QUALCOMM; he was a Senior Vice President of Hardware
Engineering, and was responsible for the OmniTRACS production
system and the Globalstar ground segment, including
gateways and phones at Qualcomm. He also served as the
Senior Vice President of Engineering for the Consumer
Products Division of QUALCOMM that was later acquired
by Kyocera. He was also co-founder of ComStream Corporation
in 1984, and worked at Linkabit Corporation from 1978
to 1984. Prior to this, Mr. Gilmore held positions in
research and development at Bell Laboratories while
a student at MIT.
Today, Robert Gilmore owns eight patents and is highly
regarded for his design and development know-how. His
technical expertise together with his managerial capabilities
will certainly contribute to VIA Telecom's strategic
advancement.
A seasoned telecommunications executive with over 30
years of experience in the China market, Yupu Xie was
recently appointed the General Manager of VIA Telecom
China. Prior to joining VIA Telecom, he was President
and Vice Chairman of Eastern Communications Company
Ltd, one of the major cellular communication equipment
manufacturers. In addition to Mr Xie's outstanding managerial
skills gained in China's mobile communications industry,
his strong R&D background will make a significant
contribution to VIA Telecom's development in the fast
growing China market.
Both executives will be presenting advances in 3G technology
at the upcoming VIA Technology Forum 2003; Robert Gilmore
at VTF Taipei on September 24 and Yupu Xie at VTF Beijing
on September 26. For further information on VTF2003
please refer to the event website at: www.via.com.tw/vtf.
About VIA Telecom, Inc.
VIA Telecom is a leading innovator and developer of
Baseband Processors for 3G CDMA2000 mobile applications
used in a wide range of 3G devices spanning voice, data,
and GPS-enabled applications. Headquartered in San Diego,
California, VIA Telecom has design centers in San Diego
and Fremont, California, and Hangzhou, China, and sales
offices in the US, Taiwan, China, and Korea. For additional
information, please visit the website at
www.via-telecom.com or send an e-mail to marketing@via-telecom.com.
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