VIA Takes Delivery of One Millionth Wafer from TSMC
Longstanding relationship fuels mutual innovation
and market leadership
Taipei, Taiwan, 23 September 2003 - VIA Technologies,
Inc, a leading innovator and developer of silicon chip
technologies and PC platform solutions, today received
its one millionth semiconductor wafer from its major
foundry partner, Taiwan Semiconductor Manufacturing
Company Ltd. (TSMC).
Long established as a market and technology leader
with its high performance core logic chipsets, VIA has
also shipped millions of processors and was first to
market with TSMC's leading edge 0.13 micron technology;
the latest processors ship with operating speeds of
up to 1GHz and beyond, with power consumption as low
as 6 watts.
"As a fabless semiconductor company, VIA's partnership
with TSMC has been a key element to our success over
the past nine years," said Mr. Wen-Chi Chen, President
and CEO, VIA Technologies, Inc. "This close relationship
has allowed us to focus on maximizing architectural
partitioning, unit performance, product quality, reliability,
and volume production. TSMC's manufacturing excellence
enables us to deliver products of the highest quality
with the latest technology in the most cost-effective
manner. With the proven success of this alliance, we
expect TSMC will remain VIA's primary foundry partner
long into the future."
"This is a great milestone for VIA," said
Dr. Rick Tsai, president of TSMC. "They currently
have many new designs for a variety of innovative applications
in the pipeline with us, and we expect an even stronger
relationship going forward. TSMC's vision is to be the
most advanced and largest technology and foundry services
provider to our customers, and in partnership with them,
to forge a powerful competitive force in the semiconductor
industry. The partnership with VIA is one of the best
realizations of this vision. In the face of the fierce
competition in the global semiconductor industry, TSMC
will continue to team up with VIA to seek long-term
win-win solutions."
One million wafers stack over 2,000 feet high and yield
hundreds of millions of individual chips that are incorporated
into a similar number of end products.
Dr. Morris Chang, Chairman and CEO at TSMC, will address
the VIA Technology Forum (VTF 2003) with a keynote speech
in Taipei tomorrow, Wednesday 24th September 2003.
About TSMC
TSMC is the world's largest dedicated semiconductor
foundry, providing the industry's leading process technology
and the foundry industry's largest portfolio of process-proven
library, IP, design tools and reference flows. The company
operates one advanced 300mm wafer fab, five eight-inch
fabs and one six-inch wafer fab. TSMC also has substantial
capacity commitments at its wholly-owned subsidiary,
WaferTech, and its joint venture fab, SSMC. In early
2001, TSMC became the first IC manufacturer to announce
a 90-nm technology alignment program with its customers.
TSMC's corporate headquarters are in Hsinchu, Taiwan.
For more information about TSMC please see http://www.tsmc.com.
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