Company Products Initiatives Resources Support Other Languages
Print pagePrint page E-mail pageE-mail page

Resources

» Home

Press Room

» Home
» PR Contacts

News Archives

» 2012 Press Room
» 2011 Archive
» 2010 Archive
» 2009 Archive
» 2008 Archive
» 2007 Archive
» 2006 Archive
» 2005 Archive

Investors

» Home

VIA Newsletters

» Sign Up!

VIA Telecom Licenses ParthusCeva TeakLite DSP Core to Power Next Generation 3G Wireless Modems

Established TeakLite DSP Technology to be integrated into cellular system on chip products

San Diego, California, 22 October 2003 - VIA Telecom, Inc, a leading innovator and developer of CDMA chipsets, today announced that it has licensed the TeakLite DSP Core of ParthusCeva, Inc. (Nasdaq: PCVA, LSE: PCV), the industry's leading licensor of Digital Signal Processor (DSP) cores and solutions, for its new product lines targeting the CDMA/CDMA2000 market. ParthusCeva and VIA Telecom have also entered into additional licensing agreements for various applications to run in conjunction with the TeakLite powered baseband; these agreements will be announced at a later date.

"ParthusCeva's TeakLite architecture gives us access to a wide array of technologies that can be built around this leading DSP core," said Ker Zhang, CEO of VIA Telecom, Inc. "Our next generation of CDMA modems will lead the industry in terms of cost, performance and power consumption and will offer best-in-class applications."

The requirement for low-power, low-cost modem solutions for the price sensitive CDMA markets drove the licensing of ParthusCeva's TeakLite DSP core over other available DSP IP solutions. ParthusCeva DSP architectures are specifically designed for high volume 2G as well as emerging 3G CDMA2000 standards.

"ParthusCeva is a true one-stop partner for DSP cores and integrated applications IP in the industry, so we are delighted that VIA Telecom has joined the community of semiconductor and handset manufacturer partners using our DSP cores for the cellular market, " said Chet Silvestri, CEO of ParthusCeva. "With our TeakLite DSP cores and VIA Telecom's broad CDMA technology base, we hope to see more market-leading products serving the next generation of handheld products."

About TeakLite

TeakLite is a 16-bit fixed-point general-purpose DSP core. Designed for low power and high-performance applications such as cellular handsets, MP3 players, disk drive controllers, cordless, VoIP terminals and various embedded control applications. TeakLite, a fully synthesizable soft core, is a process independent core that is easily portable to any ASIC library.

TeakLite is the third member of ParthusCeva's SmartCores™ family. These low-power, fixed-point licensable DSP cores offer a range of performance, price and power consumption balances, addressing a wide range of applications, from low-end, high-volume applications, such as digital answering machines, hard disk controllers, low speed modems and Voice over IP terminals, to high performance applications such as third generation (3G) cellular communications, broadband modems, consumer multimedia and Voice over IP gateways. A comprehensive portfolio of software and hardware development tools supports the SmartCores family. In addition, a large network of third party companies offers applications, tools and design services solutions.

About ParthusCeva

Headquarted in San Jose, ParthusCeva (Nasdaq: PCVA) and (LSE: PCV) is the leading licensor of DSP and a leading provider of application-specific platform Intellectual Property (IP) to the semiconductor industry. ParthusCeva was created as a result of the combination of Parthus Technologies plc, a leading provider of application-specific platform IP, and Ceva, formerly the licensing division of DSP Group, the leading licensor of DSP cores.
For more information, visit us at http://www.parthusceva.com.

About VIA Telecom, Inc.

VIA Telecom is a leading innovator and developer of Baseband Processors for 3G CDMA2000 mobile applications used in a wide range of 3G devices spanning voice, data, and GPS-enabled applications. Headquartered in San Diego, California, VIA Telecom has design centers in San Diego and Fremont, California, and Hangzhou, China, and sales offices in the US, Taiwan, China, and Korea. For additional information, please visit the website at www.via-telecom.com or send an e-mail to marketing@via-telecom.com.

Parthus Ceva Contacts:
Barry Nolan
Tel: 1-408-514-2900
+353-1-4025700

Bat-Sheva Ovadia
Tel: +972-9-952-9616
Batsheva.ovadia@parthusceva.com

VIA Telecom PR Contact

VIA PR Contacts

International:
Richard Brown
Phone: (886)-2-2218-5452 #6201
Fax: (886-2)-2218-5453
Email: Richard_Brown@via.com.tw

Note to reporters, editors and writers: VIA is spelled in ALL CAPS.

All product or service names mentioned herein are the trademarks of their respective owners.


Follow VIA on
 Home » Terms of Use » Privacy » Feedback  » Sitemap  » Contact VIA Copyright©2012 VIA Technologies, Inc.