News Release
VIA Announces Establishment of VIA Embedded Platform
Division
Unveils innovative Spearhead Platform Initiative to
enable PC OEMs and consumer electronics manufacturers
to expedite time to market for high-potential next generation
smart connected digital devices
Taipei, Taiwan, 6 January 2004 - VIA Technologies, Inc,
a leading innovator and developer of silicon chip technologies
and PC platform solutions, today announced the establishment
of the VIA Embedded Platform Division (VEPD).
Headed by seasoned industry executive Mr. Steven S. Lee,
VEPD combines the VIA Processor and VIA EPIA Mainboard
groups into a single autonomous business unit focused
on the design, development, and distribution of highly-integrated,
low power x86 platforms targeted at a broad spectrum of
high-potential markets for smart connected digital devices,
ranging from Robotics and Telematics systems to Digital
Entertainment Centers and Personal Gaming Consoles.
"The PC market is undergoing a fundamental shift,
as consumers and corporate users alike demand a new generation
of smaller, lighter, quieter, smarter and more stylish
devices that better fit in with modern lifestyles,"
commented Wenchi Chen, CEO and President of VIA Technologies,
Inc. "With the establishment of VEPD, VIA aims to
accelerate this transition by providing our customers
with the most flexible and feature-rich dedicated x86
platforms that enable these innovative products to be
brought to market quickly and more easily."
At a press lunch held today in Taipei, Taiwan, Steven
Lee outlined the core strategies for VEPD in 2004, and
unveiled the company's new Spearhead Platform Initiative
that optimizes VIA's core technology competences. Under
this program, VEPD is developing a range of complete,
interoperable platform solutions designed specifically
for next generation devices, providing PC OEMs and Consumer
Electronics manufacturers with an easily integrated platform
that will greatly reduce product development costs and
expedite time to market.
Lee also announced that VEPD will continue to expand
its industry-leading range of low-power silicon solutions
with the introduction of the new VIA CN400 Digital Media
chipset, featuring the S3 Graphics UniChrome Pro core
with hardware MPEG-2/-4 acceleration and DDR400 support,
as well as higher performance and lower power VIA Eden-N
processors with the revolutionary NanoBGA package.
In addition, Lee outlined VEPD's plans to further enhance
the highly successful line of VIA EPIA Mini-ITX mainboards,
and to step up the pace of innovation in miniature system
design with the introduction of the ground-breaking VIA
Nano-ITX form factor, delivering full PC functionality
on a footprint measuring just 12cm x 12cm.
"VIA has built up extensive expertise in the embedded
space that enables us to offer a complete service to customers
that goes beyond the component level, drawing upon the
breadth and depth of our engineering resources in hardware
and software to further shorten their time to market,"
concluded Lee. "With our aggressive roadmaps and
exciting new innovations such as the Nano-ITX and the
Spearhead Platform Initiative, VIA is paving the way for
rapid entry into these burgeoning markets, which will
in turn extend our leadership in providing the innovative
solutions our customers need to take full advantage of
exciting new market opportunities."
Please visit the VIA Embedded Platform Division website
at: www.viaembedded.com |
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