Company Products Initiatives Resources Support Other Languages
Print pagePrint page E-mail pageE-mail page


» Home

Press Room

» Home
» PR Contacts

News Archives

» 2015 Press Room
» 2014 Archive
» 2013 Archive
» 2012 Archive
» 2011 Archive
» 2010 Archive
» 2009 Archive
» 2008 Archive
» 2007 Archive
» 2006 Archive
» 2005 Archive


» Home

VIA Newsletters

» Sign Up!

News Release

VIA Announces New Processor Naming Convention

Reveals VIA C7 and VIA C7-M as the official names for processors based on the forthcoming C5J Esther core and introduces VIA C3-M as new name for current mobile processor

Taipei, Taiwan, September 17th 2004 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced a new VIA processor naming convention to strengthen the various VIA processor brands and simplify the target market segmentation for VIA processors.

The announcement introduces the VIA C7-Series of processors based on the C5J Esther core that will be available in the first half of 2005. The VIA C7 processor will target low power desktop PCs and Personal Electronics systems such as PVRs and IP set top boxes, while the VIA C7-M processor will target mainstream slim and light notebook and Tablet PCs with its market leading power efficiency and advanced PowerSaver 4.0 technology.

Based on its mounting success in the small form factor PC and entry level PC markets, VIA will continue to produce the VIA C3 processor as part of its feature rich processor platform offerings. To ensure brand continuity across mobile processor offerings, the new name for the mobile version of the VIA C3 is now the VIA C3-M processor that is currently shipping in volume.

“At a time when the market is becoming increasingly frustrated with complex CPU naming schemes, VIA is consolidating our processor offerings into families that clarify what applications they are intended for,” said Richard Brown, Associate Vice President of Marketing, VIA Technologies, Inc. “The new naming convention is based on the intended application and the feature set derived from the applicable processor core, such as on-die security features, maximum power consumption levels and power saving capabilities.”

For the embedded and thin client markets where ultra low power consumption and fanless operation are essential, VIA will continue to use the VIA Eden ESP and VIA Eden-N names for processors that have a maximum thermal design power (TDP) of a mere 7W.

More information on VIA processors is available on the VIA processor website. Information about the C5J Esther core and forthcoming on-die security features is available in the Embedded Processor Forum 2004 press release from VIA.

VIA PR Contacts

International: Europe:
Richard Brown
Phone: (886)-2-2218-5452 #6201
Fax: (886-2)-2218-5453
Michal Lisiecki
Phone: (49-2241) 39778-16
Fax: (49-2241) 39778-19

Note to reporters, editors and writers: VIA is spelled in ALL CAPS.

All product or service names mentioned herein are the trademarks of their respective owners.

Follow VIA on Facebook Google+ LinkedIn Pinterest Twitter YouTube
 Home » Terms of Use » Privacy » Feedback  » Sitemap  » Contact VIA Copyright©2015 VIA Technologies, Inc.