News Release
VIA Announces New Processor Naming Convention
Reveals VIA C7 and VIA C7-M as the official names
for processors based on the forthcoming C5J Esther core
and introduces VIA C3-M as new name for current mobile
processor
Taipei, Taiwan, September 17th 2004 - VIA Technologies,
Inc, a leading innovator and developer of silicon chip
technologies and PC platform solutions, today announced
a new VIA processor naming convention to strengthen
the various VIA processor brands and simplify the target
market segmentation for VIA processors.
The announcement introduces the VIA C7-Series of processors
based on the C5J Esther core that will be available
in the first half of 2005. The VIA C7 processor will
target low power desktop PCs and Personal Electronics
systems such as PVRs and IP set top boxes, while the
VIA C7-M processor will target mainstream slim and light
notebook and Tablet PCs with its market leading power
efficiency and advanced PowerSaver 4.0 technology.
Based on its mounting success in the small form factor
PC and entry level PC markets, VIA will continue to
produce the VIA C3 processor as part of its feature
rich processor platform offerings. To ensure brand continuity
across mobile processor offerings, the new name for
the mobile version of the VIA C3 is now the VIA C3-M
processor that is currently shipping in volume.
“At a time when the market is becoming increasingly
frustrated with complex CPU naming schemes, VIA is consolidating
our processor offerings into families that clarify what
applications they are intended for,” said Richard Brown,
Associate Vice President of Marketing, VIA Technologies,
Inc. “The new naming convention is based on the intended
application and the feature set derived from the applicable
processor core, such as on-die security features, maximum
power consumption levels and power saving capabilities.”
For the embedded and thin client markets where ultra
low power consumption and fanless operation are essential,
VIA will continue to use the VIA Eden ESP and VIA Eden-N
names for processors that have a maximum thermal design
power (TDP) of a mere 7W.
More information on VIA processors is available on
the VIA
processor website. Information about the C5J Esther
core and forthcoming on-die security features is available
in the Embedded
Processor Forum 2004 press release from VIA.
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