VIA Unveils First Pico-ITXe Board with Stackable I/O Expansion at ESC Boston
VIA EPIA-P710 utilizes new SUMIT™ connectors for the modular addition of advanced serial connectivity including PCI Express, offering developers more flexible and cost effective design options for compact embedded systems
Taipei, Taiwan, October 29 2008 - VIA Technologies, Inc., a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-P710, the world's first single board computer based on the new Pico-ITXe specification of the Small Form Factor Special Interest Group (SFF-SIG), providing a more rational approach to system design.
Supporting up to four customizable I/O expansion modules, the VIA EPIA-P710 Pico-ITXe enables a highly flexible and affordable implementation of serial connectivity options. Designed as the perfect baseboard, the VIA EPIA-P710 uses an intelligent board layout to allow efficient module stacking and aid heat dissipation.
The VIA EPIA-P710 board features two SUMIT™ (Stackable Unified Module Interconnect Technology) connectors that integrate common high and low speed, legacy and serial expansion buses, including, most notably, PCI Express, LPC, SPI and USB 2.0. This extensive support sets Pico-ITXe apart from competing standards, facilitating an off-the-shelf solution to power the next generation of embedded devices. SUMIT is an open standard administered by the SFF-SIG.
Powered by a 1GHz VIA C7® processor and the latest VIA VX800 media system processor, the VIA EPIA-P710 delivers an incredibly full-featured yet flexible, power-efficient platform within the remarkably small footprint of 10cm x 7.2cm.
"VIA is excited to be the first to deliver a truly innovative product that leverages the ultra compact dimensions and modular expandability of the new Pico-ITXe specification," said Daniel Wu, Vice President of VIA Embedded, VIA Technologies, Inc. "Our collaboration with SFF-SIG has borne a product that will set the standard for the embedded industry and shape the market for years to come."
The VIA EPIA-P710 possesses the technical diversity to offer system developers considerable scope for customizing I/O simply and cost effectively through the addition of selected Pico-I/O bus expansion modules, for demanding applications such as industrial automation, data acquisition and process monitoring. The board can also be used as a stand-alone platform for mid-range signage and kiosk solutions.
VIA EPIA-P710 Pico-ITXe: Setting the Standard for the Embedded Industry
Measuring a mere 10cm x 7.2cm the VIA EPIA-P710 uses a 1GHz VIA C7 processor and the latest VIA VX800 advanced all-in-one media system processor, which features the integrated VIA Chrome9™ IGP with DX9 Graphics and MPEG-2/4, WMV9 and VC1 video decoding acceleration. The board supports up to 2GB of DDR2 system memory, one IDE channel, two S-ATA channels and the VIA Vinyl HD Audio.
I/O configurations include two SUMIT QMS connectors that provide I/O support for up to 3 USB, 1 LPC, 2 PCIe x1, a PCIe x4, SMBus and SPI buses. Pin headers provide Gigabit LAN, VGA, LVDS, audio and front panel LED.
The VIA EPIA-P700 will ship in December 2008, with samples available to developers upon request. For more information and specifications about the VIA EPIA-P710, please visit:
Further information on the new Pico-ITXe standard may be found at the VIA website at:
Read more about the SUMIT Interface Specification on the SFF-SIG website at: www.sff-sig.org.
See the VIA EPIA-P710 at ESC Boston 2008
VIA is showcasing the first VIA Pico-ITXe board this week at ESC Boston 2008. Interested parties will be able to see the VIA EPIA-P710 stacked with I/O expansion from WinSystems, Inc. Please visit VIA at the Embedded Systems Conference, Boston, MA, USA, at booth 914. More information on VIA's participation at ESC Boston 2008 may be found at: http://www.via.com.tw/en/company/events/2008-esc-boston/index.jsp
About VIA Technologies, Inc.
VIA Technologies, Inc. is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA's global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world's top OEMs and system integrators. www.via.com.tw