Company Products Initiatives Resources Support Other Languages
Print pagePrint page E-mail pageE-mail page

Resources

» Home

Press Room

» Home
» PR Contacts

News Archives

» 2014 Press Room
» 2013 Archive
» 2012 Archive
» 2011 Archive
» 2010 Archive
» 2009 Archive
» 2008 Archive
» 2007 Archive
» 2006 Archive
» 2005 Archive

Investors

» Home

VIA Newsletters

» Sign Up!

News Release

VIA Unveils Em-ITX, the First Form Factor Standard with Dual I/O Coastlines

VIA Em-ITX form factor reduces cable clutter, improves airflow and enables sub-2cm high embedded systems

Taipei, Taiwan, 3 March 2009 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its latest board form factor for embedded system developers; the Em-ITX form factor. Offering embedded developers a compact, versatile and highly integrated board form factor, VIA's Em-ITX establishes an off-the-shelf standard for ultra-slim embedded devices.

The Em-ITX form factor is a new open industry standard defined by VIA, and is 30% more compact than Mini-ITX, yet offers 200% more I/O real estate. At 12cm x 17cm, the Em-ITX form factor includes unique dual I/O coastlines and an exclusive Em-IO expansion bus to bring unrivalled flexibility and scalability. Benefits also include reduced time-to-market cycles for developers and access to a scalable processor platform that includes the latest 64-bit VIA Nano processor.

Embedded boards based on the Em-ITX form factor will form the ideal base for industrial automation, digital signage, kiosk and other applications requiring an ultra-slim embedded device.

Dual I/O Coastlines

The VIA developed Em-ITX form factor specification includes dual I/O coastlines; I/O inputs can be found on both 17cm edges of the board. This unique design greatly reduces cable clutter facilitating even more compact and robust designs while also boosting signal integrity and improving airflow. A variety of connectors are available on these two I/O coastlines, including COM (RS-232/422/485), RJ45, DVI, VGA, LVDS, USB 2.0 and DC power signals.

Modular Expansion through Em-IO Bus

The Em-ITX form factor utilizes the Em-IO expansion bus to integrate with stackable, customizable, expansion modules. The Em-IO expansion bus integrates the majority of popular bus signal technologies, including USB 2.0, GPIO, LPC, PCIe, IDE, IEEE 1394, S-ATA, PCI, DVI, HDMI, Gigabit Ethernet and Card Bus signals.

Faster Time to Market Cycles

VIA has also designed a selection of expansion modules covering a variety of industrial applications including networked applications, multimedia display, kiosk, POI and POS applications. The expansion modules bring all the advantages of custom designed boards without the necessary development time. VIA also provides unrivalled software support including customized firmware implementations.

"VIA is known globally as a pioneer of small form factor boards that have become industry standards, and Em-ITX is the latest platform to address the evolving needs of embedded developers," said Daniel Wu, Vice President, VIA Embedded, VIA Technologies, Inc. "With its extensive I/O accessibility, this innovative form factor can deliver ultra-slim systems or customized stacked systems for a wide range of embedded applications."

Products based on the Em-ITX form factor will be available early next month.

For more details about the Em-ITX form factor please visit:
http://www.via.com.tw/en/initiatives/spearhead/em-itx/index.jsp

A white paper with more details on this new form factor is available here:
http://www.via.com.tw/en/downloads/whitepapers/initiatives/spearhead/WP090303Em-ITX.pdf

A demo featuring forthcoming Em-ITX based products will be shown at Embedded World 2009 in Germany this week. For more details, please visit the VIA website at:
http://www.via.com.tw/en/company/events/2009-ew/index.jsp

About VIA Technologies, Inc.

VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA's global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world's top OEMs and system integrators. www.via.com.tw


Follow VIA on Facebook Google+ LinkedIn Pinterest Twitter YouTube
 Home » Terms of Use » Privacy » Feedback  » Sitemap  » Contact VIA Copyright©2014 VIA Technologies, Inc.