VIA Sponsors VIA OpenBook Mini-Notes for WiMAX Covered Campus
VIA OpenBook mini-notes will help bring applications such as WiMAX IPTV, IMS, SIP and video surveillance to life at the Tatung University WiMAX Application Lab
Taipei, Taiwan, 21 April 2009 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced VIA’s participation in the Tatung University WiMAX Application Lab project that brings together industry partners and Taiwan government agencies to launch a completely WiMAX covered campus.
WiMAX coverage at Tatung University both indoors and outdoors throughout the entire campus was activated today during the ‘Open House’ launch, and the VIA Nano processor-powered VIA OpenBook mini-notes will make it possible for students and faculty to easily access and interact with WiMAX enabled applications at any time.
Projects incubated in the Tatung University WiMAX Application Lab benefit from not only a 4000-person test group but also strong partnerships with commercial businesses like VIA and Alcatel-Lucent, as well as local government agencies including the Institute for Information Industry (III).
"Driving the proliferation of connected mobile devices using leading edge technologies has long been a key priority for VIA," said Richard Brown, Vice President of International Marketing, VIA Technologies, Inc. "VIA is proud to sponsor VIA OpenBook mini-notes for the Tatung University WiMAX Application Lab to help further that goal."
At the 'Open House' today, the Tatung University WiMAX Application Lab demonstrated important strengths of WiMAX functionality including mobile coverage (since part of Taipei's subway system passes through the WiMAX enabled zone), indoor coverage, beamforming, throughput and handover coverage. Applications running over the network shown included WiMAX IPTV, video surveillance, IMS and SIP, and an automated electric meter reading program.
The VIA OpenBooks are powered by 1.0+GHz VIA Nano processors and come with 1GB of DDR2 RAM, a single-chip integrated WiMAX/BT/WiFi connectivity module, a powerful 2.0MP/0.3MP dual-headed web camera and a 1024x600 resolution LVDS screen for clear video conferencing or video surveillance performance.
The compact 8.9" VIA Openbook weighs a mere 1.1kg, making it similar in size and weight to a small text book, enabling staff and students to easily carry the device with them wherever they choose to connect on campus, whether in the lab or in the cafeteria.
You can view video coverage of today's 'Open House' at the Tatung University WiMAX Application Lab here: http://www.youtube.com/watch?v=YG7_HuhkNSc
About the VIA Nano Processor Platform
The first 64-bit, superscalar processors in VIA's x86 platform portfolio, VIA Nano processors have been specifically designed to revitalize traditional desktop and notebook PC markets, delivering truly optimized performance and security for the most demanding computing, entertainment and connectivity applications. The VIA Nano processor with the efficient 800MHz FSB is coupled with the VIA VX800 system media processor with support for full Microsoft® DirectX® 9.0 3D graphics, high definition video and audio playback, and up to 4GB of DDR2 system memory.
The VIA Nano processor family leverages advanced 65 nanometer process technology for enhanced power efficiency, and augments that with aggressive power and thermal management features within the compact 21mm x 21mm nanoBGA2 package for an idle power as low as 100mW (0.1W), extending the reach of power efficient green and silent PCs, thin and light notebooks and mini-notes around the world. For further information on the VIA Nano processor family, please visit the VIA website at: http://www.via.com.tw/en/products/processors/nano/
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA's global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world's top OEMs and system integrators. www.via.com.tw